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Manufacturer: OCZ
Price: $ 140 US
Author: Steve
Date: 06/28/2009

[ Features & Design ]

The OCZ DDR3 PC3-12800 Reaper HPC memory modules are designed to operate at 1600MHz in a triple-channel configuration on the Core i7 platform. These matched memory modules are 2048MB per stick and utilize CAS7-7-7-24 timings. These timings are impressive for DDR3 modules, particularly given that they are operating at 1600MHz.

This memory kit is only available in 6GB capacities, at least for now, which means the user gets three 2GB modules. They are covered by the OCZ lifetime warranty, which will see them operate at 1.65v, which is the maximum safe voltage for the Intel memory controller anyway.

OCZ has been pushing some new and unusual heatsink designs for some time now. First they came up with the XTC (Xtreme Thermal Convection) heatspreaders. These heatspreaders allowed for increased ventilation and heat dissipation, due to the honeycomb design that provides more direct access to the actual memory ICs.

The XTC heatspreader design was quite simple really, and since then OCZ has come up with more exciting designs that move away from traditional heatspreaders to use heatsinks. Possibly one of their most exciting series that has seen a few design changes over the years is the Reaper series. The DDR3 PC3-12800 Reaper HPC memory modules use the latest design and it looks quite impressive.

The Reaper HPC heatsink is designed to extract the heat away from the memory chips, up through a thermo-conductive copper heatpipe conduit, and then dissipate it through an aluminum fin array. By guiding heat away from key memory components, the Reaper HPC modules are designed to boost overclocking performance, while improving longevity and stability of the modules.

Not only do the Reaper HPC heatsinks look impressive, but they also have a few advantages when compared to other modules using large heatsinks. Despite looking quite large, they are actually very compact, and can easily fit side by side. Height wise the Reaper HPC design has the potential to create compatibility issues with certain components, though this would only be in rare cases.

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